Challenges of electronics production - size, geometry and design of PCB
From the progressive miniaturization of electronic components to the increasing complexity and higher packing density on PCB - electronics manufacturers today face a multitude of challenges that have a significant impact on our daily work.
Trend 1: Small and flexible PCBs - production requirements
Modern electronics are increasingly being developed to save space - devices are shrinking, and with them PCBs must also be smaller, thinner and often more flexible. Flexible PCBs make it possible to integrate electronic assemblies around corners or in curved housings, which is crucial for many applications.
PCBs that are both more flexible and smaller require new production strategies from electronics manufacturers. For example, components are increasingly being mounted directly onto flexible sections. Without suitable support, however, these PCBs can easily deform, which requires special solutions in production.
Challenges with flexible PCBs - and how they are solved
Flexible PCBs can vary in thickness, which poses challenges for conventional stencil printing. So-called stepped stencils are used to ensure that the solder paste is also applied precisely to deeper areas. These special stainless steel stencils reproduce the contours of the PCB as a negative and thus enable an even application of paste - regardless of the height of the respective layers.
Stencil printing is a crucial step in SMD production. A custom-made stainless steel stencil is used, which is precisely matched to the layout of the respective PCB. The stencil contains precise cut-outs through which solder paste is applied during the production process. In the subsequent assembly process, the components are pressed into the solder paste.
With the increasing miniaturization of electronics and components, maximum precision in stencil printing is essential. This is the only way to reliably place tiny components, which in turn ensures the quality and functionality of the assembly.
Flexible structures in PCBs can easily deform during processing. Each assembly step exerts pressure on the PCB - without additional stabilization, this can lead to deformations that affect the precision of component placement and thus the overall assembly quality.
Special production beds and holding devices are used to solve this problem. These support the PCB during the entire production process and keep it in a stable position. This ensures that all production steps - from stencil printing to assembly - can be carried out with maximum precision.
Trend 2: Thicker PCBs for higher current carrying capacity - more power in less space
The demand for high-performance electronics is growing - at the same time, devices need to become ever more compact. To meet these requirements, the thickness of PCBs is increasing. Modern multilayer PCBs consist of up to 16 layers in order to accommodate complex circuits efficiently.
Thicker PCBs offer several advantages:
- Higher current-carrying capacity: thicker copper tracks and optimized layer layout allow higher currents to be conducted safely.
- Space saving: thicker copper tracks can transmit more current, eliminating some of the wiring that would otherwise be necessary - and leaving more space in the device.
- Greater stability: The thicker material makes the PCB more robust - and is better suited to mechanically stressful components such as large press-fit connectors.
Challenges with thicker PCBs
1. increased heat capacity
Thicker PCBs always contain several inner layers of copper. However, this additional metal poses a challenge in the manufacturing process: When the PCB is heated to melt the solder paste and connect components, the copper absorbs much of the heat. This leaves less energy available for the outer layers where the components actually need to be soldered.
2. The right balance between energy supply and material protection
Precise control of the energy supply is required to ensure even heating. Too high a temperature can damage sensitive components or the PCB itself. This is why we rely on process parameters that are precisely matched to the assembly.
3. innovative solutions for the future
Modern production techniques and intelligent control of the heat supply make it possible to process even thick multilayer PCBs efficiently and reliably. This is how we ensure powerful and compact devices - without compromising on quality and reliability.
Trend 3: Bigger and thicker - challenges in signal and data transmission
In signal and data transmission, the demands on PCBs are constantly increasing. In order to efficiently bundle and transmit numerous signals, modern PCBs require more and more layers - in some cases even up to 24. This high number of layers ensures improved signal routing, but at the same time poses new challenges for design and production.
Opposing trends: miniaturization vs. growing connectors
While many electronic components are becoming smaller and smaller, connectors for signal and power transmission are growing at the same time. This development has a significant impact on the size and stability of PCBs: larger connectors require more robust PCBs to ensure reliable assembly and optimum signal transmission.
Precision despite size difference
It becomes particularly challenging when large connectors have to be placed directly next to tiny miniature components. This close combination places the highest demands on production: Each placement step must be so precise that both large and tiny components are positioned exactly and soldered without errors. Otherwise, so-called shadowing can occur, for example: Large components block access to neighboring areas on the PCB, which can impair both the soldering process and quality control.
In SMD production, shadowing occurs when large components cover smaller components or PCB areas. This becomes particularly critical in two important process steps:
- During soldering: covered areas receive too little heat so that the solder cannot melt completely. This leads to unreliable solder joints or connection errors.
- During automatic optical inspection (AOI): Large components block the lighting, preventing smaller components from being properly detected or inspected.
Solutions include thoughtful placement of large components, optimized temperature profiles in the soldering process and special AOI systems to improve visibility.
Thermal management for thick PCBs
The thicker the PCB and the higher the copper content, the more energy is required to heat the surfaces evenly. The temperature must not rise too high in order to prevent damage to the material and components. The heating process must be precisely controlled to ensure long-term stability.
Mechanical load after manufacture
Nach der Produktion sind diese großen und dicken Leiterplatten oft mechanischen Belastungen ausgesetzt. Häufig kommen Einpresstechniken zum Einsatz, um Befestigungsbolzen oder andere mechanische After production, these large and thick PCBs are often subjected to mechanical stress. Press-fit techniques are often used to integrate fastening bolts or other mechanical components. Special care is required here to avoid damaging the PCB.
Our solutions
To master these challenges, we rely on customized processes:
- Safe handling: our production is designed for PCBs of different sizes and thicknesses to ensure stability and precision.
- Targeted heat management: We apply the necessary energy efficiently without risking overheating or material damage.
- Optimized heating processes: Multi-stage processes ensure uniform heating and protect sensitive components.
- Robust production techniques: Special processes ensure that the PCBs can withstand high mechanical loads.
With these solutions, we guarantee the highest quality - regardless of the complexity of the assembly. Our goal: Reliable, tailor-made solutions that meet the highest requirements.
